The Assembly Division of MacDermid Alpha Electronics Solutions, a world leader in the production of electronics soldering and bonding materials, will exhibit at the SMTA Empire Expo & Tech Forum on Tuesday, September 28th at the RIT Inn & Conference Center in Henrietta, New York.
MacDermid Alpha will promote the adhesive, edgebond, and underfill capabilities of the ALPHA HiTech polymer solutions portfolio of products. ALPHA HiTech is a full range of electronics assembly polymer products featuring underfills, edgebonds, encapsulants, and low temperature and SMD adhesives for the Automotive, LED, Consumer Goods and Industrial markets.
“The ALPHA HiTech line of materials are designed to provide high performance products specifically designed for a wide range of applications. Everything from component Underfills and Edgebond cornerfills for component robustness enhancement, Encapsulants for waterproofing and protection, along with SMT, Low Temperature and UV Adhesives for component and material attach applications. The ALPHA HiTech family of products provide high performance technologies, at the lowest total cost of ownership to meet today’s challenging applications,” stated Regional Marketing Manager, Scott Lewin.
Additional solutions to be promoted include Alpha and Kester low temperature and high reliability solder pastes.
For additional information about MacDermid Alpha’s industry-leading assembly products and solutions, please visit MacDermidAlpha.com.